Layer count:6
Board thickness: 2.5±0.3mm
Trace/Space: 11.8/11.8mil
Surface Treatment: ENIG
Crafts: 8oz copper at inner layers,5oz copper at outer layers.
Application: Power electronics
PCB capability
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Item
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PCB capability
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PCB capability
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PCB capability
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Max Layer
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60L
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8L
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36L
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Inner Layer Min Trace/Space
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3/3mil
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3/3mil
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3/3mil
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Out Layer Min Trace/Space
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3/3mll
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3.5/4mll
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3.5/4mll
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Inner Layer Max Copper
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6oz
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2oz
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6oz
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Out Layer Max Copper
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6oz
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2oz
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3oz
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Min Mechanical Driling
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0.15mm
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0.1mm
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0.15mm
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Min Laser Drilling
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0.1mm
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0.1mm
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0.1mm
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Max Aspect Ratio(Mechanical Driling)
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20:01
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10:01
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12:01
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Max Aspect Ratio(Laser Drilling)
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1:01
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/
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1:01
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Press Fit Hole Ttolerance
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±0.05mm
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±0.05mm
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±0.05mm
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PTH Tolerance
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±0.075mm
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±0.075mm
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±0.075mm
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NPTH Tolerance
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±0.05mm
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±0.05mm
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±0.05mm
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Countersink Tolerance
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±0.15mm
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±0.15mm
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±0.15mm
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Board Thickness
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0.4-8mm
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0.1-0.5mm
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0.4-3mm
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Board Thickness Tolerance(<1.0mm)
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±0.1mm
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±0.05mm
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±0.1mm
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Board Thickness Tolerance(≥1.0mm)
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±10%
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/
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±10%
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Min Board Size
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10*10mm
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5*10 mm
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10*10mm
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Max Board Slze
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22.5*30 inch
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9*14 inch
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22.5*30 inch
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Contour Tolerance
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±0.1mm
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±0.05mm
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±0.1mm
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Min BGA
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7mil
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7mil
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7mil
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Min SMT
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7*10mil
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7*10mll
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7*10mll
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Min Solder Mask Clearance
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1.5mil
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3mil
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1.5mil
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Min Solder Mask Dam
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3mil
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8mil
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3mil
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Min Legend Width/Height
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4/23mil
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4/23mil
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4/23mil
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Strain Fillet Width
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/
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1.5±0.5mm
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1.5±0.5mm
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Bow &Twist
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0.003
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/
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0.0005
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